Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel® C624 Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.
2 Interface: 2 PCI-E 3.0 x4 M.
2 Form Factor: 22110 M.
2 Key: M-Key (RAID 0, 1 support) 1 VGA port Intel® C624 controller for 10 SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10 Dual LAN with 10GBase-T with Intel® X557