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Supermicro H11DSi Motherboard E-ATX SATA3 + 2x AMD EPYC 7601 3,2Ghz CPU 64 Threads Up to 3.2GHz SP3 180W+4x 16GB Samsung DDR4 ECC Sever Memory 2666MHz RAM 64GB Motherboards Server
SKU: 9SIAXFZJE6280364.433.850₫
1x Supermicor H11DSI-NT Motherboard2x AMD EPYC 7601 CPU4x Samsung 16GB 2666MHz RAMs DDR4We can help you test them before shipping.
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Description
You need to pay the customs duties by yourself. so, please tell us how much should we declare for the customs value.
Packageinclude: 1x Supermicor H11DSI-NT Motherboard 2x AMD EPYC 7601 CPU 4x Samsung 16GB 2666MHz RAMs DDR4 We can help you test them before shipping. AMD EPYC 7601 Specifications # of CPU Cores 32 # of Threads 64 Base Clock 2.2GH z Max Boost Clock Up to 3.2GH z All Core Boost Speed 2.7GH z Total L3 Cache 64MB Package SP3 Socket Count 1P/2P PCI Express® Version PCIe 3.0 x128 Default TDP / TDP 180W System Memory System Memory Specification Up to 2666MHz System Memory Type DDR4 Memory Channels 8 Per Socket Mem BW 170.6 GB/s Key Features Workload Affinity Analytics CAE/CFD/FEA ERM/SCM/CRM apps High capacity data mgmt (NR/RDBMS) HPC parallel Foundation Product Family AMD EPYC Product Line AMD EPYC 7001 Series Platform Server OPN Tray PS7601BDVIHAF OPN PIB PS7601BDAFWOF Specifications Product SKUs MBD-H11DSi-NT H11DSi-NT MBD-H11DSi-NT-B H11DSi-NT (Bulk Pack) Physical Stats Form Factor E-ATX Dimensions 12″ x 13.05″ ( 30.5 cm x 33.1 cm) Processor/Chipset CPU Dual AMD EPYC 7001/7002* series Processors (*Board revision 2. x required) Socket SP3 Up to 240W TDP Cores Up to 32 Cores Up to 64 Cores (Board revision 2. x required) Chipset System on Chip System Memory Memory Capacity 16 DIMM sockets Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.
Packageinclude: 1x Supermicor H11DSI-NT Motherboard 2x AMD EPYC 7601 CPU 4x Samsung 16GB 2666MHz RAMs DDR4 We can help you test them before shipping. AMD EPYC 7601 Specifications # of CPU Cores 32 # of Threads 64 Base Clock 2.2GH z Max Boost Clock Up to 3.2GH z All Core Boost Speed 2.7GH z Total L3 Cache 64MB Package SP3 Socket Count 1P/2P PCI Express® Version PCIe 3.0 x128 Default TDP / TDP 180W System Memory System Memory Specification Up to 2666MHz System Memory Type DDR4 Memory Channels 8 Per Socket Mem BW 170.6 GB/s Key Features Workload Affinity Analytics CAE/CFD/FEA ERM/SCM/CRM apps High capacity data mgmt (NR/RDBMS) HPC parallel Foundation Product Family AMD EPYC Product Line AMD EPYC 7001 Series Platform Server OPN Tray PS7601BDVIHAF OPN PIB PS7601BDAFWOF Specifications Product SKUs MBD-H11DSi-NT H11DSi-NT MBD-H11DSi-NT-B H11DSi-NT (Bulk Pack) Physical Stats Form Factor E-ATX Dimensions 12″ x 13.05″ ( 30.5 cm x 33.1 cm) Processor/Chipset CPU Dual AMD EPYC 7001/7002* series Processors (*Board revision 2. x required) Socket SP3 Up to 240W TDP Cores Up to 32 Cores Up to 64 Cores (Board revision 2. x required) Chipset System on Chip System Memory Memory Capacity 16 DIMM sockets Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.
x required) 8-channel memory bus Memory Type DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIM
Ms DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIM
Ms (Board revision 2. x required) DIMM Sizes 8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2. x required) Memory Voltage 1.2V Error Detection Corrects single-bit errors Detects double-bit errors (using ECC memory) On-Board Devices SATA SATA3 (6 Gbps) IPMI Support for Intelligent Platform Management Interface v. 2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2500 BMC Network Controllers Intel® X550 10G Base-T Ethernet Controller 1 Realtek RTL8211E PHY (dedicated IPMI) VGA ASPEED AST2500 BMC Input / Output SATA 10 SATA3 (6 Gbps) ports NVMe 2 Internal NVMe Ports (PCI-E 3.0 x4) LAN 2 RJ45 10GBase-T ports 1 RJ45 Dedicated IPMI LAN port USB 2 USB 3.0 ports (rear) 4 USB 2.0 ports (2 rear + 2 via header) VGA 1 VGA port Others 1 COM port (rear) 2 SATA DOM power connectors 1 TPM 2.0 header Expansion Slots PCI-Express 3 PCI-E 3.0 x8 2 PCI-E 3.0 x16 M.
2Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.
2module)Formfactor: 2280, 22110
Key: M-key Chassis ( Optimized for H11DSI-NT ) 2U SC213AC-R1K23LPB SC216BE1C4-R1K23LPB SC825TQC-R802LPB SC826BE1C4-R1K23LPB SC829HE1C4-R1K62LPB 3U SC836BE1C-R1K23B 4U SC745BAC-R1K28B2 SC846BE1C-R1K23B Server (s) ( with H11DSI-NT ) Model (s) AS -4023S-TRT System BIOS BIOS Type AMI 128Mb SPI Flash EEPROM BIOS Features Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1. 1 Management Software Super Doctor 5 Watch Dog NMI SUM IPMI 2.0, KVM with dedicated LAN Power Configurations ACPI Power Management Power-on mode control for AC power loss recovery PC Health Monitoring CPU Monitors CPU Core Voltages, + 1.1V, + 1.5V, + 1.8V, +12V, +5V, +5V standby CPU switching voltage regulator FAN Up to 8-fan status tachometer monitoring Up to eight 4-pin fan headers Dual Cooling Zone Status monitor for speed control Pulse Width Modulated (PWM) fan connectors Temperature Monitoring for CPU and chassis environment CPU Thermal Trip Support Thermal control for 8x Fan connectors I2C Temperature Sensing Logic LED CPU / System Overheat LED Other Features Chassis Intrusion Detection Chassis Intrusion Header UID Operating Environment / Compliance
EnvironmentalSpecificationsOperatingTemperature: 10°C to 35°C (50°F to 95°F)
Non-operatingTemperature: -40°C to 70°C (-40°F to 158°F)
OperatingRelativeHumidity: 8% to 90% (non-condensing) Non-operating
RelativeHumidity: 5% to 95% (non-condensing) Parts List Bulk Pack List Part Number Qty Description H11DSI-NT MBD-H11DSI-NT-B 1 H11DSI-NT Motherboard I/O Cable CBL-0044L 1 57.5CM SATA FLAT S-S PBF I/O Shield MCP-260-00042-0N 1 STD I/O SHIELD FOR X9 SOCKET R SERVER MB
Learn more about the Detailed Specifications
| CPU Type | AMD EPYC |
|---|
| Date First Available | May 31, 2022 |
|---|
Related products
Description
You need to pay the customs duties by yourself. so, please tell us how much should we declare for the customs value.
Packageinclude: 1x Supermicor H11DSI-NT Motherboard 2x AMD EPYC 7601 CPU 4x Samsung 16GB 2666MHz RAMs DDR4 We can help you test them before shipping. AMD EPYC 7601 Specifications # of CPU Cores 32 # of Threads 64 Base Clock 2.2GH z Max Boost Clock Up to 3.2GH z All Core Boost Speed 2.7GH z Total L3 Cache 64MB Package SP3 Socket Count 1P/2P PCI Express® Version PCIe 3.0 x128 Default TDP / TDP 180W System Memory System Memory Specification Up to 2666MHz System Memory Type DDR4 Memory Channels 8 Per Socket Mem BW 170.6 GB/s Key Features Workload Affinity Analytics CAE/CFD/FEA ERM/SCM/CRM apps High capacity data mgmt (NR/RDBMS) HPC parallel Foundation Product Family AMD EPYC Product Line AMD EPYC 7001 Series Platform Server OPN Tray PS7601BDVIHAF OPN PIB PS7601BDAFWOF Specifications Product SKUs MBD-H11DSi-NT H11DSi-NT MBD-H11DSi-NT-B H11DSi-NT (Bulk Pack) Physical Stats Form Factor E-ATX Dimensions 12″ x 13.05″ ( 30.5 cm x 33.1 cm) Processor/Chipset CPU Dual AMD EPYC 7001/7002* series Processors (*Board revision 2. x required) Socket SP3 Up to 240W TDP Cores Up to 32 Cores Up to 64 Cores (Board revision 2. x required) Chipset System on Chip System Memory Memory Capacity 16 DIMM sockets Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.
Packageinclude: 1x Supermicor H11DSI-NT Motherboard 2x AMD EPYC 7601 CPU 4x Samsung 16GB 2666MHz RAMs DDR4 We can help you test them before shipping. AMD EPYC 7601 Specifications # of CPU Cores 32 # of Threads 64 Base Clock 2.2GH z Max Boost Clock Up to 3.2GH z All Core Boost Speed 2.7GH z Total L3 Cache 64MB Package SP3 Socket Count 1P/2P PCI Express® Version PCIe 3.0 x128 Default TDP / TDP 180W System Memory System Memory Specification Up to 2666MHz System Memory Type DDR4 Memory Channels 8 Per Socket Mem BW 170.6 GB/s Key Features Workload Affinity Analytics CAE/CFD/FEA ERM/SCM/CRM apps High capacity data mgmt (NR/RDBMS) HPC parallel Foundation Product Family AMD EPYC Product Line AMD EPYC 7001 Series Platform Server OPN Tray PS7601BDVIHAF OPN PIB PS7601BDAFWOF Specifications Product SKUs MBD-H11DSi-NT H11DSi-NT MBD-H11DSi-NT-B H11DSi-NT (Bulk Pack) Physical Stats Form Factor E-ATX Dimensions 12″ x 13.05″ ( 30.5 cm x 33.1 cm) Processor/Chipset CPU Dual AMD EPYC 7001/7002* series Processors (*Board revision 2. x required) Socket SP3 Up to 240W TDP Cores Up to 32 Cores Up to 64 Cores (Board revision 2. x required) Chipset System on Chip System Memory Memory Capacity 16 DIMM sockets Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.
x required) 8-channel memory bus Memory Type DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIM
Ms DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIM
Ms (Board revision 2. x required) DIMM Sizes 8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2. x required) Memory Voltage 1.2V Error Detection Corrects single-bit errors Detects double-bit errors (using ECC memory) On-Board Devices SATA SATA3 (6 Gbps) IPMI Support for Intelligent Platform Management Interface v. 2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2500 BMC Network Controllers Intel® X550 10G Base-T Ethernet Controller 1 Realtek RTL8211E PHY (dedicated IPMI) VGA ASPEED AST2500 BMC Input / Output SATA 10 SATA3 (6 Gbps) ports NVMe 2 Internal NVMe Ports (PCI-E 3.0 x4) LAN 2 RJ45 10GBase-T ports 1 RJ45 Dedicated IPMI LAN port USB 2 USB 3.0 ports (rear) 4 USB 2.0 ports (2 rear + 2 via header) VGA 1 VGA port Others 1 COM port (rear) 2 SATA DOM power connectors 1 TPM 2.0 header Expansion Slots PCI-Express 3 PCI-E 3.0 x8 2 PCI-E 3.0 x16 M.
2Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.
2module)Formfactor: 2280, 22110
Key: M-key Chassis ( Optimized for H11DSI-NT ) 2U SC213AC-R1K23LPB SC216BE1C4-R1K23LPB SC825TQC-R802LPB SC826BE1C4-R1K23LPB SC829HE1C4-R1K62LPB 3U SC836BE1C-R1K23B 4U SC745BAC-R1K28B2 SC846BE1C-R1K23B Server (s) ( with H11DSI-NT ) Model (s) AS -4023S-TRT System BIOS BIOS Type AMI 128Mb SPI Flash EEPROM BIOS Features Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1. 1 Management Software Super Doctor 5 Watch Dog NMI SUM IPMI 2.0, KVM with dedicated LAN Power Configurations ACPI Power Management Power-on mode control for AC power loss recovery PC Health Monitoring CPU Monitors CPU Core Voltages, + 1.1V, + 1.5V, + 1.8V, +12V, +5V, +5V standby CPU switching voltage regulator FAN Up to 8-fan status tachometer monitoring Up to eight 4-pin fan headers Dual Cooling Zone Status monitor for speed control Pulse Width Modulated (PWM) fan connectors Temperature Monitoring for CPU and chassis environment CPU Thermal Trip Support Thermal control for 8x Fan connectors I2C Temperature Sensing Logic LED CPU / System Overheat LED Other Features Chassis Intrusion Detection Chassis Intrusion Header UID Operating Environment / Compliance
EnvironmentalSpecificationsOperatingTemperature: 10°C to 35°C (50°F to 95°F)
Non-operatingTemperature: -40°C to 70°C (-40°F to 158°F)
OperatingRelativeHumidity: 8% to 90% (non-condensing) Non-operating
RelativeHumidity: 5% to 95% (non-condensing) Parts List Bulk Pack List Part Number Qty Description H11DSI-NT MBD-H11DSI-NT-B 1 H11DSI-NT Motherboard I/O Cable CBL-0044L 1 57.5CM SATA FLAT S-S PBF I/O Shield MCP-260-00042-0N 1 STD I/O SHIELD FOR X9 SOCKET R SERVER MB
Learn more about the Detailed Specifications
| CPU Type | AMD EPYC |
|---|
| Date First Available | May 31, 2022 |
|---|