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23.369.201₫
Key Features 1. Embedded 3rd Generation Intel Core i7-3517UE Mobile ECC processor 2. Intel QM77 Chipset 3. Up to 16GB ECC DDR3 1600/1333MHz on 2x SO-DIMMs 4. 1x (x16) PCI-E 3.0 slot, Mini (x1) PCI-E (mSATA support) 5. 4x SATA2 3Gb/s w/ RAID 0, 1, 5, 10; 2x SATA3 6Gb/s w/ RAID 0, 1 6. Intel 82574L GbE LAN (3 ports), Intel 82579LM GbE LAN; 4 total 7. 4x USB 3.0 ports (2 rear, 2 via header) 8x USB 2.0 ports (2 rear, 6 via header) 8. Intel Integrated Graphics HD 4000 with HDMI/DP/DVI-I/eDP 9. SATA DOM Power connector 10. AMT 8.0, vPro, TPM 1.2 header
| Package Dimensions | 13.3 x 10.3 x 2.8 inches |
|---|---|
| Item Weight | 10 pounds |
| Manufacturer | SuperMicro Computer |
| ASIN | B00DOCRWC0 |
| Item model number | MBD-X9SPV-M4-3UE-B |
| Date First Available | June 27, 2013 |
Key Features 1. Embedded 3rd Generation Intel Core i7-3517UE Mobile ECC processor 2. Intel QM77 Chipset 3. Up to 16GB ECC DDR3 1600/1333MHz on 2x SO-DIMMs 4. 1x (x16) PCI-E 3.0 slot, Mini (x1) PCI-E (mSATA support) 5. 4x SATA2 3Gb/s w/ RAID 0, 1, 5, 10; 2x SATA3 6Gb/s w/ RAID 0, 1 6. Intel 82574L GbE LAN (3 ports), Intel 82579LM GbE LAN; 4 total 7. 4x USB 3.0 ports (2 rear, 2 via header) 8x USB 2.0 ports (2 rear, 6 via header) 8. Intel Integrated Graphics HD 4000 with HDMI/DP/DVI-I/eDP 9. SATA DOM Power connector 10. AMT 8.0, vPro, TPM 1.2 header
| Package Dimensions | 13.3 x 10.3 x 2.8 inches |
|---|---|
| Item Weight | 10 pounds |
| Manufacturer | SuperMicro Computer |
| ASIN | B00DOCRWC0 |
| Item model number | MBD-X9SPV-M4-3UE-B |
| Date First Available | June 27, 2013 |